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www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 1/ 17 02.mar.2012 rev.001 tsz22111 ? 14 ? 001 2.5v to 5.5v, 0.3a 1ch s ynchronous buck converter integrated fet bd9122gul general description rohms high efficiency step - down switching regulator ( bd9122gul ) is a power supply designed to produce a low voltage including 1 volts from 5/3.3 volts power supply line. offers high efficiency with our original pulse skip control technol ogy and synchronous rectifier. employs a current mode control system to provide faster transient response to sudden change in load. features offers fast trans i ent response w ith current mode pwm control system. offers highly eff iciency for all load range with synchronous rectifier (nch/pch fet) and sllm tm (simple light load mode) incorporates soft - start function. incorpora tes thermal protection and ulvo functions. incorporates short - current protection circuit with time delay function. incorporates shutdown function key specification s ? i nput voltage range: 2.5 v to 5 .5v ? output voltage range: 1.0v to 2.0 v ? o utput current: 0. 3 a (max.) ? switching frequency: 1mhz (typ.) ? pch fet on resistance: 0.3 (typ.) ? nch fet on resistance: 0. 2 (typ.) ? s tandby current: 0a (typ.) ? operating t emperature range : -25 to +85 package vcsp50l2 : 2.50mm x 1.10mm x 0.55mm applications power supply for lsi including dsp, micro computer and asic typical application circuit fig.1 typical application circuit gnd,pgnd sw vcc,pvcc en vout ith vcc vout cin rith cith l esr co ro vout product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays. datasheet
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 2/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet pin configuration pin description pin no. pin name pin function a1 pgnd nch fet source pin a2 gnd ground a3 en enable pin active high a4 ith gm amp output pin/connected phase compensation capacitor b1 s w pch/nch fet drain output pin b2 pv cc pch fet source pin b3 v cc vcc power supply input pin b4 adj output voltage detect pin block diagram fig.2 pin configuration sw b1 pvcc b2 vcc b3 adj b4 a1 pgnd a2 gnd a3 en a4 ith 3.3v input pv cc pgnd sw gnd output gm amp 4.7 h v cc r s q osc uvlo tsd + 4.7 f v cc v cc clk slope en current comp 10 f soft star t current sense/ protect + driver logic + vref ith adj r ith c ith r1 r2 scp fig. 3 block diagram (top view)
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 3/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet absolute maximum ratings (ta=25 ) parameter symbol limits unit v cc voltage v cc - 0.3 to +7 1 v pv cc volt age pv cc - 0.3 to +7 1 v en voltage v en - 0.3 to +7 v sw,ith voltage v sw ,v it h - 0.3 to +7 v power dissipation pd 660 2 mw operating temperature range topr - 25 to +85 storage temperature range tstg - 55 to +150 maximum junction temperature tjmax +15 0 1 pd should not be exceeded. 2 derating in done 5.28mw/ for temperatures above ta=25 , mounted on 50mm58mm1.6mm glass epoxy pcb. operating ratings (ta=25 ) parameter symbol limits unit min. typ. max. v cc voltage v cc *3 2.5 *4 3.3 5.5 v pv cc voltage p vcc *3 2.5 *4 3.3 5.5 v en voltage en 0 - vcc v sw average output isw *3 - - 0.3 a output voltage setting range v out 1.0 - 2.0 v 3 pd should not be exceeded. 4 in case set output voltage 1.8v or more, vccmin = 2.7v. electrical c haracteristics (ta=25 , v cc=pv cc =3.3v, en=v cc, r 1 =20k, r 2 =10k, unless otherwise specified. ) parameter symbol limits unit conditions min. typ. max. standby current i stb - 0 10 a en=gnd bias current i cc - 250 400 a en low voltage v enl - gnd 0.8 v standby mode en high voltage v enh 2.0 v cc - v active mode en input current i en - 1 10 a v en =3.3v oscillation frequency f osc 0.8 1 1.2 mhz pch fet on resistance r onp - 0.3 0.6 p vcc =3.3v nch fet on resistance r onn - 0.2 0.5 p vcc =3.3v adj volta ge v adj 0.780 0.800 0.820 v output voltage v out - 1.200 - v ith si nk current i thsi 10 20 - a v adj =1.0v ith s ource c urrent i thso 10 20 - a v adj =0.6v uvlo threshold voltage v uvlo1 2.2 2.3 2.4 v v cc =30v uvlo release voltage v uvlo2 2.22 2.35 2.5 v v c c =03v soft start time t ss 0.5 1 2 ms timer latch time t latch 1 2 4 ms scp/tsd operated output short circuit threshold voltage v scp - v out 0.5 - v v out =2 0v
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 4/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet typical performance curves fig.4 vcc - vout fig.5 ven - vout fig.6 iout - vout fig.7 ta - vout
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 5/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet fig.8 efficiency fig.9 ta - fosc fig.10 ta C ronn, ronp fig.11 ta - ven
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 6/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet fig.12 ta - icc fig .13 vcc - f osc fig.14 soft start waveform fig.15 sw waveform io=10ma
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 7/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet fig.16 sw waveform io=200ma fig.17 transient response io=50 125ma (10s) fig.18 transient response o=125 50ma (10 s)
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 8/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet application information operation bd9122gul is a synchronous rectifying step - down switching regulator that achieves faster transient response by employing current mode pwm control system. it utilizes switching operation in pwm (pulse width modulation) mode for heavier load, while it utilizes sllm (simple light load mode) operation for lighter load to impr ove efficiency. synchronous rectifier it does not require the power to be dissipated by a rectifier externally connected to a conventional dc/dc converter ic, and its p.n junction shoot - through protection circuit limits the shoot - through current during operation, by whic h the power dissipation of the set is reduced. current mode pwm control synthesizes a pwm control signal with a inductor current feedback loop added to the voltage feedback. ? pwm (pulse width modulation) control the oscillation frequency for pwm is 1 mhz . set signal form osc turns on a p - channel mos fet (while a n - channel mos fet is turned off), and an inductor current i l increases. the current comparator (current comp) receives two signals, a current feedback control signal (sense: voltage converted fr om i l ) and a voltage feedback control signal (fb), and issues a reset signal if both input signals are identical to each other, and turns off the p- channel mos fet (while a n - channel mos fet is turned on) for the rest of the fixed period. the pwm control repeat this operation. ? sllm (simple light load mode) control when the control mode is shifted from pwm for heavier load to the one for lighter load or vise versa, the switching pulse is designed to turn off with the device held operated in normal pwm c ontrol loop, which allows linear operation without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or vise versa although the pwm control loop continues to operate with a set signal from osc and a reset signal from current comp, it is so designed that the reset signal is held issued if shifted to the light load mode, with which the switching is tuned off and the switching pulses are thinned out under control. activating the switching intermittentl y reduces the switching dissipation and improves the efficiency. fig. 1 9 diagram of current mode pwm control fig.20 pwm switching timing chart fig.21 sllm tm switching timing chart current comp set reset sw v out pvcc gnd gnd gnd i l (ave) v out (ave) sense fb current comp set reset sw v out pvcc gnd gnd gnd 0a v out (ave) sense fb i l not switching i l osc level shift driver logic r q s i l sw ith cur rent comp gm amp. set reset fb load sense v out v out
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 9/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet description of operation s ? soft - start function en terminal shifted to high activates a soft - starter to gradually establish the output voltage with the current limited during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. ? shutdo wn function with en terminal shifted to low, the device turns to standby mode, and all the function blocks including reference voltage circuit, internal oscillator and drivers are turned to off. circuit current during standby is 0f (typ.). ? uvlo funct ion detects whether the input voltage sufficient to secure the output voltage of this ic is supplied. and the hysteresis width of 50 mv (typ.) is provided to prevent output chattering. fig.22 soft start, shutdown, uvlo timing chart ? short - current protection circuit with time delay function turns off the output to protect the ic from breakdown when the incorporated current limiter is activated continuously for the fixed time(t latch ) or more. the output thus held tuned off may be recov ered by restarting en or by re - unlocking uvlo. fig.2 3 short - current protection circuit with time delay timing chart h ysteresis 50mv tss tss tss soft start standby mode operating mode standby mode operating mode standby mode operating mode standby mode uvlo en uvlo uvlo v cc en v out t2=t latch output off latch en v out output short circuit threshold voltage i l standby mode operating mode operating mode en timer latch en standby mode i l limit t1 www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 10/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet information on advantages advantage 1 offers fast transient response with current mode control system. fig.24 comparison of transient response advantage 2 offers high efficiency for all load range. ? for lighter load: utilizes the current mode control mode called s llm for lighter load, which reduces various dissipation such as switching dissipation (p sw ), gate charge/discharge dissipation, esr dissipation of output capacitor (p esr ) and on - resistance dissipation (p ron ) that may otherwise cause degradation in efficien cy for lighter load. achieves efficiency improvement for lighter load. ? for heavier load: utilizes the synchronous rectifying mode and the low on - resistance mos fets incorporated as power transistor. on resistance of p - channel mos fet : 0.3(typ.) on resistance of n - channel mos fet : 0.2(typ.) fig. 25 efficiency achieves efficiency improvement for heavier load. offers high efficiency for all load range with the improvements mentioned above. advantage 3 ? supplied in smaller package due to small - sized power mos fet incorporated. reduces a mounting area requi red. fig.26 example application ? output capacitor co required for current mode control: 10f ceramic capacitor ? inductance l required for the operating frequency of 1 mhz: 2.2h inductor 0.001 0.01 0.1 1 0 50 100 pwm sllm tm inprovement by sllm system improvement by synchronous rectifier efficiency [%] output current io[a] bd9122gul (transient response i o =50ma ? 125ma) v out i out v cc =3.3v ta=25 v out =1.8v v out i out v cc =3.3v ta=25 v out =1.8v io=50 125ma io=125 50ma dc/dc convertor controller r ith l co v out c ith v cc cin 8mm 8mm r ith c ith c in c o l c vcc
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 11 / 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet switching regulator efficiency efficiency ? may be expressed by the equation shown below: efficiency may be improved by reducing the switching regulator power dissipation factors p d as follows: dissipation factors: 1) on resistance dissipation of inductor and fet pd(i 2 r) 2) gate charge/discharge dissipation pd(gate) 3) switching dissipation pd(sw) 4) esr dissipation of capacitor pd(esr) 5) operating current dissipation of ic pd(ic) 1)pd(i 2 r)=i out 2 (r coil +r on ) (r coil [] dc resistance of inductor, r on [] on resistance of fet, i out [a] output current.) 2)pd(gate)=cgsfv (cgs[f] gate capacitance of fet, f[h] switching frequency, v[v] gate driving voltage of fet) 4)pd(esr)=i rms 2 esr (i rms [a] ripple curren t of capacitor, esr[] equivalent series resistance.) 5)pd(ic)=vini cc (i cc[a] circuit current.) consideration on permissible dissipation and heat generation as this ic functions with high efficiency without significant heat generation in most applicati ons, no special consideration is needed on permissible dissipation or heat generation. in case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/o r heat generation must be carefully considered. for dissipation, only conduction losses due to dc resistance of inductor and on resistance of fet are considered. because the conduction losses are considered to play the leading role among other dissipatio n mentioned above including gate charge/discharge dissipation and switching dissipation. fig.27 thermal derating curve (vcsp50l2) if v cc =3.3v, v out =1.5v, r onp =0.3, r onn =0.2 i out =0.3a, fo r example, d=vout /v cc =1.5/3.3=0.45 r on =0.450.3+(1 - 0.45)0.2 =0.135+0.11 =0.245[] p=0.3 2 0.245 P 22.1[mw] as r onp is greater than r onn in this ic, the dissipation increases as the on duty becomes greater. with the consideration on the dissipation as abo ve, thermal design must be carried out with sufficient margin allowed. = v out i out viniin 100[%]= p out pin 100[%]= p out p out +p d 100 [%] vin 2 c rss i out f i drive 3)pd(sw)= (c rss [f] reverse transfer capacitance of fet, i drive [a] peak current of gate.) p=i out 2 r on r on =dr onp +(1 - d)r onn d on duty (=v out /v cc ) r coil dc resistance of coil r onp on resistance of p - channel mos fet r onn on resistance of n - channel mos fet i out output current power dissipation:pd [w] ambient temperature:t a [ ] 0 25 50 75 100 125 150 0 1.0 0.66w vcsp50l2(2.501.10mm) rohm standard 1 layer board board size 50mm58mm j - a=189.4 /w 0.8 0.6 0.4 0.2
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 12/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet selection of components externally connected 1. selection of inductor (l) * current exceeding the current rating of the inductor results in magnetic satur ation of the inductor, which decreases efficiency. the inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating. * select the inductor of low resistance component (such as dcr and acr) to minimize dissipation in the inductor for better efficiency. 2. selection of output capacitor (c o ) as the output rise time must be designed to fall within the soft - start time, the capacitance of output capacitor should be determined with considera tion on the requirements of equation (5): if v out =1.5v, i out =0.3a, and t ss =1ms, inappropriate capacitance may cause problem in startup. 10f to 100f ceramic capacitor is recommended. 3. selection of input capacitor (cin) a low esr 10f/10v ceramic capacitor is recommended to reduce esr dissipatio n of input capacitor for better efficiency. the inductance significantly depends on output ripple current. as seen in the equation (1), the ripple current decreases as the inductor and/or switching frequency increases. i l = (v cc - v out )v out lv cc f [a] ??? (1) appropriate ripple current at output should be 30% more or less of the maximum output current. i l =0.3i out max. [a] ??? (2) l= (v cc - v out )v out i l v cc f [h] ??? (3) (i l : output ripple current, and f: switching frequency ) output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required to smooth ripple voltage. output ripple voltage is determined by the equation (4) v out =i l esr [v ] ??? (4) (i l : output ripple current, esr: equivalent series resistance of output capacitor) * rating of the capacitor should be determined allowing sufficient margin against output voltage. less esr allows reduction in output ripple voltage. input capacitor to select must be a low esr capacitor of the capacitance sufficient to cope with hi gh ripple current to prevent high transient voltage. the ripple current i rms is given by the equation ( 6 ): i rms =i out v out (v cc - v out ) v cc [a] ??? (6) when vcc is twice the v out , i rms = i out 2 fig.29 o utput capacitor < worst case > i rms(max.) i rms =0.3 1.5(3.3 - 1.5) 3.3 =0.15[a rms ] 3 . 3 fig.30 input capacitor i l v cc il l co v out fig.28 output ripple current i l v cc l co v out esr v cc l co v out cin if v cc =3.3v, v out =1.5v, and i outmax.= 0.3a co Q t ss (i limit - i out ) v out ??? (5) tss: soft - start time ilimit: over current detection level, 1a(typ) co Q 1m(1 - 0.3) 1.5 P 467 [f]
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 13/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet 4. determination of r ith , c ith that works as a phase compensator as the current mode control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a cr filter cons isting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its esr. so, the phases are easily compensated by adding a zero to the power amplifier output with c and r as described below to cancel a pole at the power amplifier. stable feedback loop may be achieved by canceling the pole fp (min.) produced by the output capacitor and the load resistance with cr zero correction by the error amplifier. 5. determination of output voltage the output voltage v out is determined by the equation ( 7 ): vout =(r2/r1+1) v adj ??? (7) v adj : voltage at adj terminal (0.8v typ.) with r1 and r2 adjusted, the output voltage may be determined as required. adjustable output voltage range : 1.0v to 2.0v use 1 k? to 100 k? resistor for r1. if a resistor of the resistance higher than fig.3 4 determination of output voltage fig.31 open loop gain characteristics fig.32 error amp phase compensation characteristics fp= 2 r o c o 1 fz (esr) = 2e sr c o 1 pole at power amplifier when the output current decreases, the load resistance ro increases and the pole frequency lowers. fp (min.) = 2r omax. c o 1 [hz]with lighter load fp (max.) = 2r omin. c o 1 [hz] w ith heavier load zero at power amplifier fz (amp.) = 2r ith c ith 1 gnd,pgnd sw v cc ,pv cc en v out ith v cc v out cin r ith c ith l esr c o r o v out fig.33 typical application fz (amp.) = fp (min.) 2r ith c ith 1 = 2 r omax. c o 1 gain [db] phase [deg] a 0 0 - 90 a 0 0 - 90 fz(amp.) fp(min.) fp(max.) fz(esr) i out min. i out max. gain [db] phase [deg] sw adj l co r2 r1 output increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (this is because when the capacitance is doubled, the capacitor esr r educes to half.)
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 14/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet cautions on pc board layout fig.3 5 layout diagram for the sections drawn with heavy line, use thick conductor pattern as short as possible. lay out the input ceramic capacitor c in closer t o the pins pv cc and pgnd, and the output capacitor c o closer to the pin pgnd. lay out c ith and r ith between the pins ith and gnd as neat as possible with least necessary wiring. recommended components lists on above application symbol part value manufactu rer series l coil 2.2uh fdk mipf2016d2r2 c in ceramic capacitor 10uf murata grm188b30j106me47b c o ceramic capacitor 10uf murata grm188b30j106me47b c ith ceramic capacitor v out =1.0v 2200pf murata grm15 series v out =1.2v v out =1.5v v out =1.8v 1 000pf v out =2.0v r ith resistance v out =1.0v 6.8k rohm mcr006 6801 v out =1.2v v out =1.5v v out =1.8v 4.7k mcr006 4701 v out =2.0v * the parts list presented above is an example of recommended parts. although the parts are sound, actual circuit characteristi cs should be checked on y our application carefully before use. be sure to allow sufficient margins to accommodate variations between external devices and this ic when employing the depicted circuit with other circuit constants modified. both static and transient characteristics sh ould be considered in establishing these margins. when switching noise is substantial and may impact the system, a low pass filter should be inserted between the vcc and pvcc pins, and a schottky barrier diode established between the sw and pgnd pins. sw pvcc vcc adj pgnd gnd en ith c o gnd v out v cc l r ith c ith c in en r2 r1
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 15/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet i/o equivalent circuit fig.36 i/o equivalent circuit en ? en pin ? sw pin pv cc sw pv cc pv cc ith ? ith pin v cc ? adj pin adj
www.rohm.com tsz02201-0j3j0aj00110-1-2 ? rohm co., ltd. all rights reserved. 16/ 17 02.mar.2012 rev.001 ts z22111 ? 15 ? 001 0j3j0aj00110 data s heet operational notes 1. absolute maximum ratings while utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operating temperature range may result in breakage. if broken, short - mode or open - mode may not be identified. so if it is expected to encounter wit h special mode that may exceed the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses. 2. electrical potential at gnd gnd must be designed to have the lowest electrical potential in any oper ating conditions. 3. short - circuiting between terminals, and mismounting when mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. failure to do so may result in ic breakdown. short - circuiting due to foreign matter s entered between output terminals, or between output and power supply or gnd may also cause breakdown. 4. operation in strong electromagnetic field be noted that using the ic in the strong electromagnetic radiation can cause operation failures. 5. therm al shutdown protection circuit thermal shutdown protection circuit is the circuit designed to isolate the ic from thermal runaway, and not intended to protect and guarantee the ic. so, the ic the thermal shutdown protection circuit of which is once activa ted should not be used thereafter for any operation originally intended. 6. inspection with the ic set to a pc board if a capacitor must be connected to the pin of lower impedance during inspection with the ic set to a pc board, the capacitor must be discharged after each process to avoid stress to the ic. for electrostatic protection, provide proper grounding to assembling processes with special care taken in handling and storage. when connecting to jigs in the inspection process, be sure to tur n off the power supply before it is connected and removed. 7. input to ic terminals this is a monolithic ic with p + isolation between p - substrate and each element as illustrated below. this p - layer and the n - layer of each element form a p - n junction, and various parasitic element are formed. if a resistor is joined to a transi stor terminal as shown in fig 37 . p- n junction works as a parasitic diode if the following relationship is satisfied; gnd>terminal a (at resistor side), or gnd>terminal b (at trans istor side); and if gnd>terminal b (at npn transistor side), a parasitic npn transistor is activated by n - layer of other element adjacent to the above - mentioned parasitic diode. the structure of the ic inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. it is therefore requested to take care not to use the device in such manner that the voltage lower than gnd (at p - substrate) may be applied to the input termin al, which may result in activation of parasitic elements. fig.37 simplified structure of monorisic ic 8. ground wiring pattern if small - signal gnd and large - current gnd are provided, it will be recommended to separate the large - current gnd pat tern from the small - signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of th e small - signal g nd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a referen ce t o help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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